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Select Technology:
Rigid
Flex
IMS
Rigid Flex
Cust Part Number:
Item Desc:
Upload File:
Delivery Format
Single
Array
Configure Panel
PCB Size X (mm)
PCB Size Y (mm)
PCB Qty X
PCB Qty Y
PCB Separation
Milling
Scoring(V-CUT)
Milling and Scoring
Complicated V Cut
Jump V Cut
Milling + Jump V Cut
Milling with steige
Milling with steige & Breakage Hole
Milling with steige+Scoring
Milling with steige & Breakage Hole+Scoring
No Separation
PCB Area (dm2)
Estimated Weight
kg
Panel Size X (mm)
Panel Size Y (mm)
Array Area (dm2)
Total Area
XOut
--
<=5
6 to 10
11 to 20
21 to 30
31 to 50
51 to 100
PCB Parameters
Panel JSON
Panel Image
Stackup JSON
Stackup Image
UOM
mm
Inch
VCUT Length :
Jump VCUT Places:
Big Panel Size:
--
Yes
No
Min Line:
Cu Layers:
PCB Thickness:
Final Cu Outer:
--
18 µm (0.5 oz)
35 µm (1 oz)
52 µm (1.5 oz)
70 µm (2 oz)
90 µm (2.5 oz)
105 µm (3 oz)
125 µm (3.5 oz)
140 µm (4 oz)
160 µm (4.5 oz)
175 µm (5 oz)
195 µm (5.5 oz)
210 µm (6 oz)
230 µm (6.5 oz)
245 µm (7 oz)
265 µm (7.5 oz)
280 µm (8 oz)
300 µm (8.5 oz)
315 µm (9 oz)
335 µm (9.5 oz)
350 µm (10 oz)
370 µm (10.5 oz)
385 µm (11 oz)
405 µm (11.5 oz)
420 µm (12 oz)
Final Cu Inner:
--
18 µm (0.5 oz)
35 µm (1 oz)
52 µm (1.5 oz)
70 µm (2 oz)
90 µm (2.5 oz)
105 µm (3 oz)
125 µm (3.5 oz)
140 µm (4 oz)
160 µm (4.5 oz)
175 µm (5 oz)
195 µm (5.5 oz)
210 µm (6 oz)
230 µm (6.5 oz)
245 µm (7 oz)
265 µm (7.5 oz)
280 µm (8 oz)
300 µm (8.5 oz)
315 µm (9 oz)
335 µm (9.5 oz)
350 µm (10 oz)
370 µm (10.5 oz)
385 µm (11 oz)
405 µm (11.5 oz)
420 µm (12 oz)
PTH Copper :
No
20 µm
18 to 25µm
<25 µm
>=25 µm
>=30 µm
35 µm
40 µm
Surface Finish:
--
HAL Lead Free
ENIG 2U
ENIG 3U
ENEPIG 3U(NiPdAu)
Immersion Tin
Immersion Silver
OSP
ENIG 4U
ENIG 5U
No Surface(Bare Cu)
Drill Quantity:
MultiPanel Gerber:
--
2
3
4
5
Separate Gerber:
--
2
3
4
5
Route Len / Panel
IPC Class:
--
IPC Class 2
IPC Class 3
Min Space:
Small BGA :
--
>= 200 µm
< 200 µm
Small IC :
Pth to Line inner :
Min Drill Size:
--
None
0.1
0.15
0.2
0.25
>=0.3
Press Fit:
--
Yes
No
Coil Track Board:
--
Yes
No
ROHs:
--
No
Top Cu
Bot Cu
Top Mask
Bot Mask
Top Silk
Bot Silk
Base Material:
--
FR4-TG135
FR4-TG150
FR4-TG170
FR4-TG180
FR4 Halogen Free
Rogers-4003c
Rogers-4350B
PI
FR4+PI
Alu
FR4 Tg150 S100H(er 4,6@1GHz)
FR4 Tg170 S1000-2M(er 4,6@1GHz)
FR4 Tg170 S1000-2(er 4,4@1GHz)
FR4 Tg150 KB6165F(er 4,8-5,0@1MHz)
FR4 Tg170 KB6167F(er 4,6@1GHz)
FR4 Tg150 IT-158(er 4,3@1GHz)
FR4 Tg 170 IT-180(er 4,4@1GHz)
FR4 Tg170 R1755V(er 4,4@1GHz)
Bare Board :
--
Yes
No
Spl. Stackup Core :
--
1
2
3
4
5
Non Std Stackup PP:
--
2
4
6
8
Ducttape
@ViewBag.ducttape@
Cu Layers
FPC Thickness
Final Cu Outer
--
18 µm (0.5 oz)
35 µm (1 oz)
52 µm (1.5 oz)
70 µm (2 oz)
90 µm (2.5 oz)
105 µm (3 oz)
125 µm (3.5 oz)
140 µm (4 oz)
160 µm (4.5 oz)
175 µm (5 oz)
195 µm (5.5 oz)
210 µm (6 oz)
230 µm (6.5 oz)
245 µm (7 oz)
Final Cu Inner
--
35 µm (1 oz)
70 µm (2 oz)
105 µm (3 oz)
140 µm (4 oz)
175 µm (5 oz)
210 µm (6 oz)
245 µm (7 oz)
Min Space
Min Line/AR
Min Drill Size
--
None
0.1
0.15
0.2
0.25
>=0.3
Stackup:
--
Yes
No
Base Material PP:
--
TG 135 PP
TG 150 PP
TG 170 PP
TG 180 PP
Special TG 135 PP
Special TG 150 PP
Special TG 170 PP
Special TG 180 PP
Extra 1 PP
Extra 1 High TG PP
Solder Mask:
--
No
Top
Bot
Top + Bot
Mask Color:
--
No
Green
Blue
Red
Black
White
Bright White(LED)
Legend:
--
No
Top
Bot
Top + Bot
Double Color Legend
Mask Type:
--
Standard Gloss
Standard Matte
Taiyo Gloss
Taiyo Matte
Masking 2X:
--
Yes
No
Legend Color:
--
No
White
yellow
Black
Logo:
--
Top Cu
Bot Cu
Top Mask
Bot Mask
Top Silk
Bot Silk
UL:
--
No
US
CA
CA+US
DateCode:
--
No
Top Cu
Bot Cu
Top Mask
Bot Mask
Top Silk
Bot Silk
Leadfree:
--
Yes
No
E-test:
--
No
Yes
Yes + ET Stamp
Etest Fixture:
--
E-test Flying Probe
E-test Fixture
ET_Sign_E-test Fixture
ET_Sign_E-test Flying Probe
E-Test Points / panel:
LED Order:
Imped Ctrl:
--
No
Yes
Yes (Report + coupon)
Impedence Qty:
Micro Sec Report:
--
Yes
No
Destructive Report:
--
Yes
No
Solder Sample:
--
Yes
No
Blind/Buried Vias:
--
No
Blind
Buried
Blind+Buried
Edge Plating:
--
No
Yes
Special Via Filling:
--
IPC 4761 Type IIIb
IPC 4761 Type IVb
IPC 4761 Type V
IPC 4761 Type VII
No
Via Filling:
--
Yes
No
Print Serial No:
--
Yes
No
Plated Slots:
--
No
Yes
Half PTH:
--
No
Yes
Half PTH Min:
Z Routing:
--
No
Top
Bot
Top+Bot
Countersunk:
--
No
Top
Bot
Top+Bot
Countersunk Qty:
Abnormal Hole:
--
Abnormal slot
stair slot
bell mouth hole
high-ratio hole
No Of Edges:
--
1
2
3
4
Via Caping:
--
Yes
No
Utilization Perc:
edge_connector:
--
No
GoldFinger Qty:
Kapton Tape:
--
TOP
BOT
TOP+BOT
No
Chamfer:
--
No
20
30
45
Counterbore:
--
No
Top
Bot
Top+Bot
Counterbore Qty:
Hard GoldFinger:
--
No
Yes
Au:5U"/Ni:120U"
Au:10U"/Ni:120U"
Au:15U"/Ni:120U"
Au:20U"/Ni:120U"
Au:25U"/Ni:120U"
Au:30U"/Ni:120U"
No Repair:
--
Yes
No
SMD pads on Top:
ALU Dielectric :
--
1W/mK
1.5W/mK
2W/mK
3W/mK
Coverlay:
--
No
Top
Bottom
Top+Bottom
Coverlay Color:
--
Yellow
Black
White
Stiffener :
--
No
Top
Bottom
Top+Bottom
Carbon Ink:
--
Yes
No
Peelable Mask:
--
No
Top
Bot
Top+Bot
Smd2Smd :
--
<=200 µm
201 to 249 µm
>=250 µm
Stacked/Staggered Via:
--
NO
YES
Stacked
Staggered
Via Inpad:
--
YES
NO
EMPB:
--
YES
NO
Min AR:
SMD pads on Bottom:
ALU Dielectric Thickness :
Paper Between PCB :
LPP Hardgold :
Backdrill PCB :
Remarks :
Stencil:
--
Top
Bot
Top+Bottom
Stencil Type:
Top
Bottom
Top+Bottom
Show Other Details
Buried Vias:
--
No
Yes
Control Dielectric:
--
Yes
No
Aspect Ratio:
--
<=8:1
>8:1
Taiyoink :
--
Yes
No
Low Matl Utilization:
--
Yes
No
Hole Density:
--
Rigid Flex:
--
Yes
No
Flex:
--
Yes
No
Total No Drill Holes:
Slides:
--
0
1
2
Tooling Standard:
Tooling Tech:
@ViewBag.tooling_tech@
Quantity
Currency
Delivery Schedule
Shipping Date
Discount %
Tooling Cost
Shipping Option:
Ätzwerk
Customer
Shipping Cost
Unit Cost
Margin %
Margin Amount
Unit Price (Incl. Shipping)
Cost to Customer
VAT %
VAT Amount
Price Incl. VAT
Calculate
Add to Cart
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Array Format Configuration
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PCB Dimension:
mm → x
mm ↑ y
Arrangement:
Spaces:
mm → x
mm ↑ y
Editing:
Scoring
Milled with bars
Scoring
Milled with bars
Scoring
Milled with bars
Scoring
Milled with bars
Web/tab with perforation
Frame:
mm ↑ y
mm → x
mm → x
mm ↑ y
Scoring
Export Image
Shape:
Round
Square
Add
Size:
Mask:
Offset X:
Y:
Remove
Tool Size:
Mask:
Offset X:
Y:
Add
Remove
TL
TR
BL
BR
Multi-use ready layout
×
PCB per Panel:
Panel Dimension:
mm → x
X
mm ↑ y
Mechanical Processing:
Scoring
Milled with Web/tabs
Web/tab with perforation
Mix-Panel
×
Different Designs:
PCB per Panel:
Panel Dimension:
mm → x
X
mm ↑ y
Mechanical Processing:
Scoring
Milled with Web/tabs
Web/tab with perforation
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Item Details
Parameters & Values
Delivery Format:
Carbon Ink:
Type:
PCB Size X(mm):
PCB Size Y(mm):
PCB Area(dm2):
PCB Qty X:
PCB Qty Y:
PCB Separation:
Array Size X(mm):
Array Size Y(mm):
Array Area(dm2):
VCUT Length :
Jump VCUT Places:
Big Panel Size:
Layers:
Min Space
IPC Class:
PCB Thickness:
Small BGA :
Rohs Marking:
Final Copper O/L:
Small IC :
Stackup:
Final Copper I/L:
Pth to Line Inner:
Base Material:
PTH Copper :
Min Drill Size:
Base Material PP:
Surface Finish:
Press-fit:
Bare Board:
Drill Quantity:
Coil Track Board:
Special Stackup Core:
Route Len / Panel:
X out:
Non Std Stackup PP:
Soldermask:
Mask Type:
Legend:
Mask Color:
Masking 2x:
Legend Color:
UL:
Print Serial No:
Min Line:
E-Test:
E-Test Points/panel:
No Repair :
Imped. Ctrl:
Slots:
Edge Plating:
Half PTH:
Half PTH Min:
DateCode:
Impedence Qty:
Z-routing:
Special Via Filling:
Countersunk:
Countersunk Qty:
Blind/Buried Vias:
Solder Sample:
Chamfer:
EMPB:
Hard GoldFinger:
GoldFinger Qty:
Peelable Mask:
Counterbore:
CounterBore Qty:
Min AR:
Smd2Smd:
Stacked/Staggered Via:
Via Inpad:
Seperate Gerber:
Multipanel Gerber:
Kapton Tape:
ALU Dielectric:
ALU Dielectric Thickness:
Coverlay:
Coverlay Color:
Stiffener :
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